Chip On Board Assemblies
Almost every semiconductor can be sourced as chip as well. We offer design services to design and manufacture, based on your schematic, a chip on board system. As we do not only have state of the art assembly lines for chip and wire bonding, we also have the latest equipment for qualifying and testing the COB assembly in house. From pressure cooker to temperature shock cycling we can give you detailed answers about the reliability of your COB unit.
Following chips can be used (customer supplied or we supply them)
These chips will be assembled onto substrates. Following substrates can be used:
After assembly the substrates and chips will be encapsulated. Following encapsulations are available:
Once the encapsulation is done, there can be a further system integration by:
100% screening, test capability of wavelength, power, radiation, focal points, goniometric tests, environmental test, EMI tests and much more ( although we often experience that our customers still know one more test we don't ). As you can see, the nature of this type of business is quite complex. We can assure you, that we take care of your specific business. Please use the CONTACT button to the left to request a phone call or a meeting we will contact you soon !